Engineering Services
Engineering Services
Engent provides a variety of engineering services that allow its customers to launch new products and technologies effectively.
- Packaging and Process Technology Selection and Qualification
- Materials Selection and Qualification
- Advanced Surface Mount Processing and Advanced Packaging
- Advanced Process Development and Deployment
- Failure Mode Analysis
- Reliability Qualification
Technology Commercialization
Electronic Printed Circuit Board Prototyping
Electronic Product Testing
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Flip Chip Assembly Process Development, Reliability Assessment And Process Characterization For Polymer Stud Grid Array-Chip Scale PackageRead More ›
The Polymer Stud Grid Array (PSGA) package has several significant advantages over conventional package configurations, including the high potential for…
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Experimental Wetting Dynamics Study Of Eutectic And Lead-Free Solders Varying Flux, Temperature And Surface Finish MetallizationRead More ›
Modern electronics demand improved solder bump interconnects, including high density, small size, and fine pitch. Specifically, solder wetting onto bond…
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Technology CommercializationRead More ›
Engent provides customer support from conception through manufacturing. Our engineers employ applications that support proof of concept development, prototyping and…
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Flip Chip TechnologyRead More ›
Flip chip, or C4 (controlled collapse chip connection), is a system-in-package assembly service that provides numerous benefits over other processes…
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Next Generation Engineering and Process DevelopmentRead More ›
Turnkey Next Generation Manufacturing Services Module, SIP, and Hybrid Package Production Design Layout Parts Procurement Assembly Balling Overmolding Final Test…
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MEMS Technology and PackagingRead More ›
Engent provides advanced MEMS (micro electro mechanical systems) technology and packaging services that benefit a wide variety of applications. Designed…
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Surface Mount Assembly and ProcessingRead More ›
Engent provides advanced surface mount technology (SMT) assembly services across a variety of electronic circuit applications. In modern electronic circuit…
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Reliability TestingRead More ›
Engent utilizes state-of-the-art electronic product testing equipment to ensure maximum product reliability and performance. Our equipment tests for shock, vibration,…
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Packaging and Process Technology Selection and QualificationRead More ›
Semiconductor wafer solder bumping technologies specification (evaporation, electroplating, stencil printing) Under bump metalization specification (sputtering, evaporation, electroless plating) Advanced Assembly…
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Materials Selection and QualificationRead More ›
Qualified Surface Finish Selection Flux Selection Underfill Selection Solder mask Selection Substrate Selection Qualified Material Systems Read More
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Advanced Process Development and DeploymentRead More ›
Qualified Surface Finish Selection Flux Selection Underfill Selection Solder mask Selection Substrate Selection Qualified Material Systems
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Electronic Failure AnalysisRead More ›
Engent’s electronic failure analysis services are refined to produce the most accurate product results and develop appropriate measures to prevent…
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Failure Analysis In DepthRead More ›
BGA Analysis and Cross-Section Problem: Determine the cause of voids that appear in BGA balls that contain a microvia beneath…
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Assembly Failure Mode AnalysisRead More ›
Problem: Determine the preliminary failure mode for a manufacturer based on the attachment process being used. Analysis: X-ray is used…
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Flip Chip Processing Using Wafer-Applied UnderfillsRead More ›
Wafer-level underfill has the potential to substantially increase the implementation and usage of flip chip technology in the electronics industry,…
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Evaluation, Optimization, And Reliability Of No-Flow Underfill ProcessRead More ›
Underfills, used in flip chip packaging, help mitigate the effects of the large Coefficient of Thermal Expansion (CTE) mismatch between…
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Flux-Underfill Compatibility And Failure Mode Analysis In High Yield Flip Chip ProcessingRead More ›
There are many factors that govern flip chip process yield, and with those come various challenges. One of those is…
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Reliability Assessment Of Flip Chip On Organic Board Using Power Cycling TechniquesRead More ›
In this white paper, the reliability assessment of flip chip on organic board (FCOB) using power cycling techniques from a…