Engineering Services

Engineering Services

Engent provides a variety of engineering services that allow its customers to launch new products and technologies effectively.

  • Packaging and Process Technology Selection and Qualification
  • Materials Selection and Qualification
  • Advanced Surface Mount Processing and Advanced Packaging
  • Advanced Process Development and Deployment
  • Failure Mode Analysis
  • Reliability Qualification

Technology Commercialization

Electronic Printed Circuit Board Prototyping

Electronic Product Testing

  • All
  • Capabilities
  • Services
  • Case Studies
  • Technology Papers
  • Flip Chip Assembly Process Development, Reliability Assessment And Process Characterization For Polymer Stud Grid Array-Chip Scale Package

    The Polymer Stud Grid Array (PSGA) package has several significant advantages over conventional package configurations, including the high potential for…

    Read More ›
  • Experimental Wetting Dynamics Study Of Eutectic And Lead-Free Solders Varying Flux, Temperature And Surface Finish Metallization

    Modern electronics demand improved solder bump interconnects, including high density, small size, and fine pitch. Specifically, solder wetting onto bond…

    Read More ›
  • Technology Commercialization

    Engent provides customer support from conception through manufacturing. Our engineers employ applications that support proof of concept development, prototyping and…

    Read More ›
  • Flip Chip Technology

    Flip chip, or C4 (controlled collapse chip connection), is a system-in-package assembly service that provides numerous benefits over other processes…

    Read More ›
  • Next Generation Engineering and Process Development

    Turnkey Next Generation Manufacturing Services Module, SIP, and Hybrid Package Production Design Layout Parts Procurement Assembly Balling Overmolding Final Test…

    Read More ›
  • MEMS Technology and Packaging

    Engent provides advanced MEMS (micro electro mechanical systems) technology and packaging services that benefit a wide variety of applications. Designed…

    Read More ›
  • Surface Mount Assembly and Processing

    Engent provides advanced surface mount technology (SMT) assembly services across a variety of electronic circuit applications. In modern electronic circuit…

    Read More ›
  • Reliability Testing

    Engent utilizes state-of-the-art electronic product testing equipment to ensure maximum product reliability and performance. Our equipment tests for shock, vibration,…

    Read More ›
  • Packaging and Process Technology Selection and Qualification

    Semiconductor wafer solder bumping technologies specification (evaporation, electroplating, stencil printing) Under bump metalization specification (sputtering, evaporation, electroless plating) Advanced Assembly…

    Read More ›
  • Materials Selection and Qualification

    Qualified Surface Finish Selection Flux Selection Underfill Selection Solder mask Selection Substrate Selection Qualified Material Systems Read More

    Read More ›
  • Advanced Process Development and Deployment

    Qualified Surface Finish Selection Flux Selection Underfill Selection Solder mask Selection Substrate Selection Qualified Material Systems

    Read More ›
  • Electronic Failure Analysis

    Engent’s electronic failure analysis services are refined to produce the most accurate product results and develop appropriate measures to prevent…

    Read More ›
  • Failure Analysis In Depth

    BGA Analysis and Cross-Section Problem: Determine the cause of voids that appear in BGA balls that contain a microvia beneath…

    Read More ›
  • Assembly Failure Mode Analysis

    Problem: Determine the preliminary failure mode for a manufacturer based on the attachment process being used. Analysis: X-ray is used…

    Read More ›
  • Flip Chip Processing Using Wafer-Applied Underfills

    Wafer-level underfill has the potential to substantially increase the implementation and usage of flip chip technology in the electronics industry,…

    Read More ›
  • Evaluation, Optimization, And Reliability Of No-Flow Underfill Process

    Underfills, used in flip chip packaging, help mitigate the effects of the large Coefficient of Thermal Expansion (CTE) mismatch between…

    Read More ›
  • Flux-Underfill Compatibility And Failure Mode Analysis In High Yield Flip Chip Processing

    There are many factors that govern flip chip process yield, and with those come various challenges. One of those is…

    Read More ›
  • Reliability Assessment Of Flip Chip On Organic Board Using Power Cycling Techniques

    In this white paper, the reliability assessment of flip chip on organic board (FCOB) using power cycling techniques from a…

    Read More ›