Engent’s new website showcases how it moves electronics to market fast
New website’s bold look and enhanced navigation allows customers and prospects to easily explore how Engent can help keep pace…
Read More ›Engent Acquires Rights to Siemens Dematic Advanced Assembly Technology Center
Engent, Inc. and Siemens Dematic Electronics Assembly Systems, Inc. (EAS) have signed an agreement for Engent to assume the rights…
Read More ›IPC Solder Products Value Council, Solectron, Flextronics and U.S. NAVSEA Begin Reliability Test Program on Lead Free Solder
Association Connecting Electronics Industries® announced today that its Solder Products Value Council (SPVC) has begun a comprehensive study of the…
Read More ›SMT Magazine :: Q & A
Daniel F. Baldwin, president of Engent Inc., answers questions about the implementation challenges of Lead-free solder in Flip Chip and…
Read More ›SMT Magazine :: Q & A
Daniel F. Baldwin, president of Engent Inc., answers questions about the advantages of a Design for Manufacturing (DFM) environment and…
Read More ›Engent Announces its Lead Free Deployment Solutions Program
Engent, Inc. has announced the creation of its Lead Free Deployment Solutions Program. The use of lead in electronics products…
Read More ›SMT Magazine Q&A :: World-class manufacturing
As the manufacturing sector continues to recover and orders continue to grow, claims about world-class manufacturing are ever present in…
Read More ›Flip Chip Presentation Draws Local IMAPS and SMTA Members
For the second time this year, SMTA Boston and IMAPS New England members shared ideas and information over dinner in…
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