Flip Chip Assembly Process Development, Reliability Assessment And Process Characterization For Polymer Stud Grid Array-Chip Scale Package
The Polymer Stud Grid Array (PSGA) package has several significant advantages over conventional package configurations, including the high potential for miniaturization in addition to the process cost saving potential.
Download our white paper to learn more about key elements of PSGA technology, including:
- developing a high throughput flip chip assembly process technology for PSGA-CSP configurations using existing Surface Mount Technology (SMT)
- qualifying the reliability performance of flip chip PSGA packages