Engent provides a variety of engineering services that allow its customers to launch new products and technologies effectively.
Packaging and Process Technology Selection and Qualification
Materials Selection and Qualification
Advanced Surface Mount Processing and Advanced Packaging
Advanced Process Development and Deployment
Failure Mode Analysis
Reliability Qualification
The Polymer Stud Grid Array (PSGA) package has several significant advantages over conventional package configurations, including the high potential for…
Modern electronics demand improved solder bump interconnects, including high density, small size, and fine pitch. Specifically, solder wetting onto bond…
Engent provides customer support from conception through manufacturing. Our engineers employ applications that support proof of concept development, prototyping and…
Flip chip, or C4 (controlled collapse chip connection), is a system-in-package assembly service that provides numerous benefits over other processes…
Turnkey Next Generation Manufacturing Services Module, SIP, and Hybrid Package Production Design Layout Parts Procurement Assembly Balling Overmolding Final Test…
Engent provides advanced MEMS (micro electro mechanical systems) technology and packaging services that benefit a wide variety of applications. Designed…
Engent provides advanced surface mount technology (SMT) assembly services across a variety of electronic circuit applications. In modern electronic circuit…
Engent utilizes state-of-the-art electronic product testing equipment to ensure maximum product reliability and performance. Our equipment tests for shock, vibration,…
Semiconductor wafer solder bumping technologies specification (evaporation, electroplating, stencil printing) Under bump metalization specification (sputtering, evaporation, electroless plating) Advanced Assembly…
Qualified Surface Finish Selection Flux Selection Underfill Selection Solder mask Selection Substrate Selection Qualified Material Systems Read More
Qualified Surface Finish Selection Flux Selection Underfill Selection Solder mask Selection Substrate Selection Qualified Material Systems
Engent’s electronic failure analysis services are refined to produce the most accurate product results and develop appropriate measures to prevent…
BGA Analysis and Cross-Section Problem: Determine the cause of voids that appear in BGA balls that contain a microvia beneath…
Problem: Determine the preliminary failure mode for a manufacturer based on the attachment process being used. Analysis: X-ray is used…
Wafer-level underfill has the potential to substantially increase the implementation and usage of flip chip technology in the electronics industry,…
Underfills, used in flip chip packaging, help mitigate the effects of the large Coefficient of Thermal Expansion (CTE) mismatch between…
There are many factors that govern flip chip process yield, and with those come various challenges. One of those is…
In this white paper, the reliability assessment of flip chip on organic board (FCOB) using power cycling techniques from a…