SMT Magazine :: Q & A
Comments Off on SMT Magazine :: Q & ADaniel F. Baldwin, president of Engent Inc., answers questions about the advantages of a Design for Manufacturing (DFM) environment and automating the process to ensure high-yield volume manufacturing.
Engent Announces its Lead Free Deployment Solutions Program
Comments Off on Engent Announces its Lead Free Deployment Solutions ProgramEngent, Inc. has announced the creation of its Lead Free Deployment Solutions Program. The use of lead in electronics products has been considered an environmental issue and is beginning a “phase out” in different parts of the world.
SMT Magazine Q&A :: World-class manufacturing
Comments Off on SMT Magazine Q&A :: World-class manufacturingAs the manufacturing sector continues to recover and orders continue to grow, claims about world-class manufacturing are ever present in the industry. Dr. Baldwin describes the key differentiators of a world-class manufacturer.
Flip Chip Presentation Draws Local IMAPS and SMTA Members
Comments Off on Flip Chip Presentation Draws Local IMAPS and SMTA MembersFor the second time this year, SMTA Boston and IMAPS New England members shared ideas and information over dinner in a joint meeting and presentation, held March 21, 2006, at the Holiday Inn Boxborough Woods. The evening’s program included a presentation titled “Flip Chip Technology – What, Why, and How?” by Daniel Baldwin, Ph.D., Professor of Mechanical Engineering at the Georgia Institute of Technology, and co-founder of Engent, provider of advanced electronic manufacturing and technology services. Baldwin also serves on Advanced Packaging’s Editorial Advisory Board.
FlipChip International and Engent Announce Strategic Alliance to Develop and Deploy 3D Wafer Level CSP Technologies
Comments Off on FlipChip International and Engent Announce Strategic Alliance to Develop and Deploy 3D Wafer Level CSP TechnologiesFlipChip International and Engent today announced a strategic alliance aimed at accelerating the development and deployment of 3D Wafer Level CSP (WLCSP)Technologies for highly integrated stacked die packaging applications. This technology has the possibility of enabling packaging solutions that are quicker to market and lower cost than System-On-Chip alternatives. Engent is a prominent leader in 3D flip chip assembly and FlipChip International is the world’s leading wafer level bumping company.
Engent Receives ISO 9001:2000 Certification
Comments Off on Engent Receives ISO 9001:2000 CertificationEngent, Inc. received its ISO 9001:2000 certification through Underwriters Laboratories Inc. on February 22, 2008. ISO 9001:2000 is recognized worldwide as the standard for quality management systems. Engent’s quality management system was approved for the manufacturing of electronic and micro-electronic assemblies and packages.
Dr. Daniel Baldwin named President-Elect of SMTA
Comments Off on Dr. Daniel Baldwin named President-Elect of SMTADr. Daniel F. Baldwin, President, of Engent Inc. has been elected to serve as the President for the Surface Mount Technology Association (SMTA). The SMTA is an International network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. Dr. Baldwin has been active with SMTA for 13 years and has served in several leadership roles including member of the SMTA International technical program committee and Co-Chair of the SMTA 3D/SiP/Advanced Packaging Symposium, and on the Board of Directors for the past six years as a Member of the Planning Committee, the Chair of the Planning Committee, and Treasurer. Dr. Baldwin, said, “I am honored to be selected to serve our industry in the capacity of SMTA President. The SMTA fills a vital role in the electronics industry by providing a forum for the industry to keep moving towards solutions that foster competiveness and innovation.”
Engent Receives ITAR Registration Renewal
Comments Off on Engent Receives ITAR Registration RenewalEngent has received its annual International Traffic Arms in Regulation (ITAR) approval for registration from the US department of States, Bureau of Political-Military Affairs. ITAR regulations dictate that information and material pertaining to defense and military related technologies may only be shared with U.S. persons unless approval from the Department of State is received or a special exemption is used. This classification is a requirement for many defense related manufacturing and development programs. Matt Perry, Engent’s Vice President of Sales, noted “Engent is committed to providing a valuable, advanced technology service offering to our customers. Our unique electronics manufacturing and development infrastructure allows us to support programs that require both Surface Mount electronics and Micro-electronics assembly. We are seeing more small form factor applications that require ITAR compliance and are positioned well to support these programs.”