Flip Chip Presentation Draws Local IMAPS and SMTA Members

Boxborough, MA

For the second time this year, SMTA Boston and IMAPS New England members shared ideas and information over dinner in a joint meeting and presentation, held March 21, 2006, at the Holiday Inn Boxborough Woods. The evening’s program included a presentation titled “Flip Chip Technology – What, Why, and How?” by Daniel Baldwin, Ph.D., Professor of Mechanical Engineering at the Georgia Institute of Technology, and co-founder of Engent, provider of advanced electronic manufacturing and technology services. Baldwin also serves on Advanced Packaging’s Editorial Advisory Board.