FlipChip International and Engent Announce Strategic Alliance to Develop and Deploy 3D Wafer Level CSP Technologies

Phoenix, AZ, May, 23, 2006

FlipChip International and Engent today announced a strategic alliance aimed at accelerating the development and deployment of 3D Wafer Level CSP (WLCSP)Technologies for highly integrated stacked die packaging applications. This technology has the possibility of enabling packaging solutions that are quicker to market and lower cost than System-On-Chip alternatives. Engent is a prominent leader in 3D flip chip assembly and FlipChip International is the world’s leading wafer level bumping company.