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Wafer Processing

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Wafer processing is an important aspect of providing the capability to offer microelectronics assembly services. In order to provide die assembly, the die must be prepared in a format that is compatible to either wire bond or flip chip assembly. Preparation of the die includes the following items:

  • Wafer saw, sort, and inspect
  • Wafer Thinning
  • Wafer Bumping
  • Die Banking
  • Known Good Die
  • Tested at Speed

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