Wafer processing is an important aspect of providing the capability to offer microelectronics assembly services. In order to provide die assembly, the die must be prepared in a format that is compatible to either wire bond or flip chip assembly. Preparation of the die includes the following items:
- Wafer saw, sort, and inspect
- Wafer Thinning
- Wafer Bumping
- Die Banking
- Known Good Die
- Tested at Speed
Engent’s EMS expertise is designed to enable high volume manufacturing while shortening time to market. The suite of services we provide ensures high-yield production of the industry’s most robust and reliable products available on the market. Our EMS expertise includes design, engineering, manufacturing, as well as electronic component testing and OEM assembly.
Our approach to manufacturing provides our clients with the flexibility to scale manufacturing to meet business needs, so materials, resources and expertise are only leveraged when necessary, resulting in higher efficiency and cost effective manufacturing models.