Flux-Underfill Compatibility And Failure Mode Analysis In High Yield Flip Chip Processing

There are many factors that govern flip chip process yield, and with those come various challenges. One of those is the compatibility of flux and underfill, as it is intended to provide a robust flip chip process window and acceptable reliability.

Download our white paper to learn more about flux-underfill compatibility and failure mode analysis in high yield flip chip processing, including:

• how the compatibility of flux and underfill material systems significantly contributes to the formation and growth of process-induced defects
• an in-depth analysis of failure modes, including underfill delamination, solder fatigue, and die cracking, all in an effort to determine long-term reliability

Download the White Paper