Evaluation, Optimization, And Reliability Of No-Flow Underfill Process

Underfills, used in flip chip packaging, help mitigate the effects of the large Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and the laminate circuit board by reducing the strain on the solder joints. There are a series of steps that have to be taken, particularly during the no-flow underfill process, in order for it to be successful. These include:

• utilizing fluxing underfills that are dispensed onto the substrate before placement
• placing the die onto the dispensed underfill
• reflowing and curing the assembly simultaneously in a standard reflow oven

Download our white paper to learn more about achieving the optimal processing for increased reliability. You’ll uncover how we optimized the placement and reflow parameters for a no-flow process using four commercially available underfill materials, and how we successfully developed a near void free no flow underfill dispense process.

Download the White Paper