Posted by Engent, Inc. on | Comments Off on Engent’s new website showcases how it moves electronics to market fast
New website’s bold look and enhanced navigation allows customers and prospects to easily explore how Engent can help keep pace with changing market demands and accelerate their product development life cycle.
NORCROSS, Ga. – Engent, a leading provider of next-generation microelectronics development, testing and manufacturing services, is pleased to announce the launch of its new website, engentaat.com. The site is designed to showcase Engent’s unique capabilities as a company at the forefront of today’s electronics industry.
The website’s bold look and enhanced navigation allows customers and prospects to easily explore how Engent can help them keep pace with changing market demands and accelerate their product development life cycle.
“The constant demand for smaller, lighter and more functional and durable electronics continues to challenge the industry,” said Matt Perry, vice president of sales and one of Engent’s founders.
“As outsourcing and offshore trends accelerate, it’s becoming more difficult to commercialize new designs without massive yield losses during the early stages of production,” Perry added. “Our new website helps us to tell our story. It shows how we can help today’s electronics and assembly markets bring concepts to market fast.”
Founded in 2003, Engent provides product development and full-scale production to a variety of customers. Engent serves the military, medical and industrial sectors, as well as other microelectronic markets. Engent also provides innovation in miniaturization and process development to the consumer electronics divisions of Fortune 50 companies. Its team of experts consults with a global network at all stages, from ideation to product supply to deployment.
Visitors to Engent’s website can:
Explore how the company’s services and capabilities accelerate time to market and enable high volume product manufacturing
Get to know Engent’s experienced leadership team
Learn about the company through news items and events
Review case studies and technology papers that showcase detailed market solutions
“If your product roadmap is telling you it’s time to press forward, but your manufacturer is telling you ‘no’, we’ll do everything we can to complete your assembly so you can quickly move your device from concept to consumer,” said Perry.
About Engent: Engent, Inc. is a leading provider of next generation microelectronics development and manufacturing services. Located in Norcross, GA, Engent was founded in 2003 to provide world class production, development and engineering services for small form factor electronics. Engent engages in all stages of the electronic miniaturization process and serves key electronic and microelectric markets in the military, medical and industrial sectors with clients ranging from budding entrepreneurial technology firms to Fortune 50 companies. Visit us @ www.engentaat.com
Posted by Engent, Inc. on | Comments Off on Engent Acquires Rights to Siemens Dematic Advanced Assembly Technology Center
Engent, Inc. and Siemens Dematic Electronics Assembly Systems, Inc. (EAS) have signed an agreement for Engent to assume the rights to the Advanced Assembly Technology (AAT) Center contracts, equipment and personnel located in Norcross, Georgia. Additionally, Engent will become a member of the newly formed Siemens Dematic Technology Network, and the two companies will work closely together to provide advanced technology solutions to the electronics industry.
Posted by Engent, Inc. on | Comments Off on IPC Solder Products Value Council, Solectron, Flextronics and U.S. NAVSEA Begin Reliability Test Program on Lead Free Solder
Association Connecting Electronics Industries® announced today that its Solder Products Value Council (SPVC) has begun a comprehensive study of the three leading lead free alloys (Tin-Silver-Copper) in an effort to analyze the properties of the leading candidates for lead free assembly.
Posted by Engent, Inc. on | Comments Off on SMT Magazine :: Q & A
Daniel F. Baldwin, president of Engent Inc., answers questions about the implementation challenges of Lead-free solder in Flip Chip and CSP Applications.
Posted by Engent, Inc. on | Comments Off on SMT Magazine :: Q & A
Daniel F. Baldwin, president of Engent Inc., answers questions about the advantages of a Design for Manufacturing (DFM) environment and automating the process to ensure high-yield volume manufacturing.
Posted by Engent, Inc. on | Comments Off on Engent Announces its Lead Free Deployment Solutions Program
Engent, Inc. has announced the creation of its Lead Free Deployment Solutions Program. The use of lead in electronics products has been considered an environmental issue and is beginning a “phase out” in different parts of the world.
Posted by Engent, Inc. on | Comments Off on SMT Magazine Q&A :: World-class manufacturing
As the manufacturing sector continues to recover and orders continue to grow, claims about world-class manufacturing are ever present in the industry. Dr. Baldwin describes the key differentiators of a world-class manufacturer.
Posted by Engent, Inc. on | Comments Off on Flip Chip Presentation Draws Local IMAPS and SMTA Members
For the second time this year, SMTA Boston and IMAPS New England members shared ideas and information over dinner in a joint meeting and presentation, held March 21, 2006, at the Holiday Inn Boxborough Woods. The evening’s program included a presentation titled “Flip Chip Technology – What, Why, and How?” by Daniel Baldwin, Ph.D., Professor of Mechanical Engineering at the Georgia Institute of Technology, and co-founder of Engent, provider of advanced electronic manufacturing and technology services. Baldwin also serves on Advanced Packaging’s Editorial Advisory Board.
