FlipChip International and Engent Announce Strategic Alliance to Develop and Deploy 3D Wafer Level CSP Technologies
FlipChip International and Engent today announced a strategic alliance aimed at accelerating the development and deployment of 3D Wafer Level…
Read More ›Engent Receives ISO 9001:2000 Certification
Engent, Inc. received its ISO 9001:2000 certification through Underwriters Laboratories Inc. on February 22, 2008. ISO 9001:2000 is recognized worldwide…
Read More ›Dr. Daniel Baldwin named President-Elect of SMTA
Dr. Daniel F. Baldwin, President, of Engent Inc. has been elected to serve as the President for the Surface Mount…
Read More ›Engent Receives ITAR Registration Renewal
Engent has received its annual International Traffic Arms in Regulation (ITAR) approval for registration from the US department of States,…
Read More ›Engent Hires Andrey Karnauch as Operations Manager
Industry veteran will help company better serve electronics market through enhanced production services and quality assurance.
Read More ›Engent Hires Brian Spratt as Business Development Manager
In efforts to bolster their sales services in the southeast United States, Engent, a leading provider of next generation electronic…
Read More ›Engent Expands Testing Capabilities in Response to Customer Demand
In response to customer demand, Engent, a leading provider of next generation electronics manufacturing and technology services, has added SPEA…
Read More ›Engent Expands Operations
In order to ramp-up production capacity and accelerate new product development efforts, Engent recently expanded its Norcross, GA facility by…
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