News
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FlipChip International and Engent Announce Strategic Alliance to Develop and Deploy 3D Wafer Level CSP Technologies
Phoenix, AZ, May, 23, 2006
FlipChip International and Engent today announced a strategic alliance aimed at accelerating the development and deployment of 3D Wafer Level...
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Engent Receives ISO 9001:2000 Certification
Norcross, GA.
Engent, Inc. received its ISO 9001:2000 certification through Underwriters Laboratories Inc. on February 22, 2008. ISO 9001:2000 is recognized worldwide...
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Dr. Daniel Baldwin named President-Elect of SMTA
Norcross, GA.
Dr. Daniel F. Baldwin, President, of Engent Inc. has been elected to serve as the President for the Surface Mount...
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Engent Receives ITAR Registration Renewal
Engent has received its annual International Traffic Arms in Regulation (ITAR) approval for registration from the US department of States,...
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Engent Hires Andrey Karnauch as Operations Manager
Industry veteran will help company better serve electronics market through enhanced production services and quality assurance.
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Engent Hires Brian Spratt as Business Development Manager
Atlanta, GA, Feb. 10, 2014
In efforts to bolster their sales services in the southeast United States, Engent, a leading provider of next generation electronic...
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Engent Expands Testing Capabilities in Response to Customer Demand
Atlanta, GA, Apr. 14, 2014
In response to customer demand, Engent, a leading provider of next generation electronics manufacturing and technology services, has added SPEA...
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Engent Expands Operations
In order to ramp-up production capacity and accelerate new product development efforts, Engent recently expanded its Norcross, GA facility by...
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