Reliability Assessment Of Flip Chip On Organic Board Using Power Cycling Techniques

In this white paper, the reliability assessment of flip chip on organic board (FCOB) using power cycling techniques from a service field-oriented reliability assessment methodology is discussed. Ultimately, the paper concludes with how design for field reliability is achievable by the effective design modifications and manufacturing process improvements at the prototyping stage.

Download this white paper to learn more about the reliability of the flip chip on organic board assemblies and what the linkage among the design, manufacturing process, and the ultimate field reliability is prior to mass production.

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