Electronic Printed Circuit Board Prototyping


Electronic printed circuit board (PCB) prototyping is a critical element within the development of a new printed circuit board design. Engent specializes in PCB prototyping, as part of a complete package of circuit board services.

In the prototyping phase, our expert engineers thoroughly review and provide the feedback which is require for the application or system along with our customer. We work closely with our customer to ensure the prototype meets the required specifications.

Implementing effective prototyping saves money and lowers investment risk while ensuring efficiency of printed circuit board development through measures such as:

  • Addressing anticipated and unexpected technical challenges.
  • Conducting a series of different implementations to analyze performance and identify next steps.
  • Ensuring chosen design accurately meets specifications.

Printed Circuit Board Assembly


Engent’s highly skilled technicians engineer printed circuit board assembly (PCBA) with the best soldering options on either single or double-sided circuit boards. Our capabilities include high volume, machine led production as well as small volume, handcrafted projects requiring extreme precision. Because some applications demand great physical stress while others are untouchable, our PCBA services include both through-hole and surface-mount soldering techniques that fit any technology package.

Our advanced inspection and quality control techniques maintain consistency across important metrics including:

  • Soldering integrity
  • Analog signature
  • Voltage and frequency
  • Functionality validation

In our world-class facilities, our highly experienced teams are capable of meeting any package demands. Whether applications are designed for consumer or military use, Engent’s customized solutions offer:

  • Virtually all weights and sizes
  • Drilling
  • Laser microvia capabilities
  • Scoring
  • Edge connector beveling
  • Bonding
  • Heat sinks
  • Back plates
  • Buried chip resistors
  • Silkscreen and solder mask

Our PCBs come in a variety of surface finish and mixed finish options, including:

  • Full body or bondable gold
  • Electroless nickel immersion gold
  • HASL with selective gold
  • Dual gold plating
  • Immersion gold with selective hard gold
  • Copper
  • Plated or electroless nickel
  • Hot air solder level
  • Immersion silver
  • OSP
  • Immersion tin
  • Recessed fingers

Engent works with a wide range of printing materials within RoHS, RF and advanced RF, backed with PCB FR-4 manufacturing, the most common insulation among rigid printed circuit boards.

Our printed circuit board assembly (PCBA) services utilize some of the most advanced equipment in the industry to ensure technology packages are assembled correctly to produce highly reliable products. Our experienced engineers proudly use Siemens Dematic machinery capable of a placement rate of 50,000 components per hour, ensuring quick completion of projects at a minimal cost. We’ve also invested in machines designed for maximum modularity and an extremely high degree of flexibility. Our equipment is ideal for a variety of applications, including packages requiring specialized nozzles and grippers for oddly-shaped components.

 

Engent also offers several other circuit board and advanced SMT assembly services, including:

 

  • Flip chip assembly
  • 01005, 0201 through 55 mm BGA processing
  • Advanced area array packages (FPBGA, CCGA, HBGA, Double Sided BGA, Mirror BGA)
  • Chip scale package (CSP) assembly
  • 0.3mm – 0.5mm wafer scale CSP (WLCSP) assembly
  • Lead-free solder
  • Optoelectronics assembly
  • Fiber splicing
  • High-density large panel assembly

Box Build Services


At Engent, our turnkey box build services allow us to provide a complete solution that doesn’t stop at assembly. Our experienced manufacturing teams ensure enclosure fabrication, installation of subassemblies and components, and routing of cabling or wire harnesses are built to our customers exacting standards and fit their unique needs.

Engent’s box build manufacturing services include:

  • Cabinet assembly
  • Control panels
  • Racks and enclosures
  • Cable assembly
  • Panel wiring
  • Sub-assemblies

Electronic Failure Analysis


Engent’s electronic failure analysis services are refined to produce the most accurate product results and develop appropriate measures to prevent the recurrence of failure. Our services combine the most advanced technologies with the talent of our expert engineers.

  • Area array packages (BGAs, CSPs, flip chip)
  • MEMS structures
  • Hybrid micro circuits
  • Multi-chip modules
  • Integrated circuits
  • Discrete transistors and diodes
  • Photonic devices (VCSELs, laser diodes, LEDs)
  • Chip on board
  • RF, microwave, and SAW devices

Engent’s analytical and failure analysis equipment includes:

  • Low pressure SEM
  • SEM backscatter detector
  • Energy disperse X-Ray analysis
  • High magnification polarizing light/dark field microscope
  • Metallagraph
  • Differential contrast microscope
  • X-Ray florescence microscope
  • Megapixel digital camera
  • CSAM (acoustic microscopy)
  • IR microscope
  • 3D surface inspection system
  • High speed digital video camera
  • Digital image analysis software
  • Boroscope
  • FT-IR
  • DSC (digital scanning calorimeter)
  • Rheometer
  • Viscometer
  • TGA (thermo gravimetric analysis)
  • DMA (dynamic mechanical analysis)
  • TMA (thermo mechanical analysis)

Read our case studies (add link here) for an in-depth look at how Engent engineers solve problems with product failures.

Electronic Packaging Service


Engent specializes in electronic packaging services, ensuring that every product and component we design, engineer and manufacture is appropriately packaged for optimal functionality and sustained value.

Engent’s expert electronic packaging services include, but are not limited to:

  • PCB assemblies
  • Liquid filling
  • Hermetic metal/glass cases
  • Hermetic ceramic packages
  • Glob top
  • Conformal coating
  • Molded plastic
  • Sheet metal
  • Cast metal
  • Potting
  • Porosity sealing

Engent’s electronic packaging protects critical components from exposure to hostile elements and mechanical damage while maintaining proper heat dissipation and a marketable aesthetic.

Engent currently offers a variety of solutions including:

  • 3D packaging
  • System in packaging (SiP)
  • MEMS packaging

Our experts have spent years developing the best processes and solutions that reduce package size and cost. Engent engineered a novel packaging strategy based on modular, reconfigurable components that allow us to provide significant cost savings over conventional solutions while increasing the commercial viability of a wide range of microsystems.

Electronic Components Manufacturing


At Engent, our electronic components manufacturing services are guided by years of experience and innovation. We recognize that the technologies behind electronic component manufacturing services are ever evolving, and require expert attention to ensure best practices, services and products meet the highest industry standards. Our specialists possess the skills and expertise necessary to deliver products and packages built with only the best electronic components.

Engent’s next generation manufacturing services include:

  • Module, SIP, and Hybrid Package Production
  • Design Layout
  • Parts Procurement
  • Assembly
  • Balling
  • Overmolding
  • Final Testing
  • Advanced SMT Production including: Flip chip, 0201s, Lead-Free, CSP, Optoelectronics, and MEMS Packaging
  • Direct Chip Attach
  • Multi-Chip Module Assembly
  • Miniaturized Passives and Resistors (01005s)
  • Advanced Technology Product Prototyping
  • Design for Manufacturability Consulting

Integrated Circuit Packaging


Integrated circuit packaging (IC packaging) provides secure casing for custom microelectronics, protecting circuits and electrical contact connections from corrosion or other abrasive physical damage.

Engent also offers several other circuit board and advanced SMT assembly services, including:

  • Flip chip assembly
  • 01005, 0201 through 55 mm BGA processing
  • Advanced area array packages (FPBGA, CCGA, HBGA, Double Sided BGA, Mirror BGA)
  • Chip scale package (CSP) assembly
  • 0.3mm – 0.5mm wafer scale CSP (WLCSP) assembly
  • Lead-free solder
  • Optoelectronics assembly
  • Fiber splicing
  • High-density large panel assembly

Chip on Board Assembly and Packaging


Chip on board (COB) assembly or packaging is a semiconductor assembly technology meant to eliminate conventional device packaging. Assembly directly mounts the microchip or die, connecting it to the circuit board with die-attach adhesive and curing with heat or ultra-violet light. Our expert engineers then complete the wirebonding process to protect against chemical and mechanical damage.

  • Reduced space requirements
  • Reduced cost
  • Simplified manufacturing
  • Increased performance
  • Better protection against reverse-engineering

Engent also offers several other circuit board and advanced SMT assembly services, including:

  • Flip chip assembly
  • 01005, 0201 through 55 mm BGA processing
  • Advanced area array packages (FPBGA, CCGA, HBGA, Double Sided BGA, Mirror BGA)
  • Chip scale package (CSP) assembly
  • 0.3mm – 0.5mm wafer scale CSP (WLCSP) assembly
  • Lead-free solder
  • Optoelectronics assembly
  • Fiber splicing
  • High-density large panel assembly

Wafer Processing


Wafer processing is an important aspect of providing the capability to offer microelectronics assembly services. In order to provide die assembly, the die must be prepared in a format that is compatible to either wire bond or flip chip assembly. Preparation of the die includes the following items:

  • Wafer saw, sort, and inspect
  • Wafer Thinning
  • Wafer Bumping
  • Die Banking
  • Known Good Die
  • Tested at Speed

Burn In