Thermal Dissipation Analysis In Flip Chip On Board And Chip On Board Assemblies
There is increasing application of direct chip attach packaging technologies in electronics manufacturing. This white paper explores the thermal management of three direct chip attach technologies, including experimental measurements of junction-to-ambient thermal resistance and thermal dissipation paths for three interconnect technologies:
- solder attach
- anisotropic adhesive attach
- isotropic adhesive attach
Download our white paper to learn more about the first order chip-scale thermal design model for flip chip assemblies that exhibits good agreement with experimental measurements.