Processing And Reliability Of Flip Chip With Lead-Free Solders On Halogen-Free Microvia Substrates
Not only is the electronics industry looking to make smaller, lighter products, but also ones that are environmentally friendly. This white paper takes a look at flip chip assembly processes and reliability in the context of environmentally conscious aspects of manufacturing and high process throughput.
Download our white paper to learn more about implementing green, low cost flip chip material systems and processing in an effort to minimize environmental impact.
Download the white paper now.