Printed Circuit Board Assembly

Engent’s highly skilled technicians engineer printed circuit board assembly (PCBA) with the best soldering options on either single or double-sided circuit boards. Our capabilities include high volume, machine led production as well as small volume, handcrafted projects requiring extreme precision. Because some applications demand great physical stress while others are untouchable, our PCBA services include both through-hole and surface-mount soldering techniques that fit any technology package.

Our advanced inspection and quality control techniques maintain consistency across important metrics including:

• Soldering integrity
• Analog signature
• Voltage and frequency
• Functionality validation

In our world-class facilities, our highly experienced teams are capable of meeting any package demands. Whether applications are designed for consumer or military use, Engent’s customized solutions offer:

• Virtually all weights and sizes
• Drilling
• Laser microvia capabilities
• Scoring
• Edge connector beveling
• Bonding
• Heat sinks
• Back plates
• Buried chip resistors
• Silkscreen and solder mask

Our PCBs come in a variety of surface finish and mixed finish options, including:

• Full body or bondable gold
• Electroless nickel immersion gold
• HASL with selective gold
• Dual gold plating
• Immersion gold with selective hard gold
• Copper
• Plated or electroless nickel
• Hot air solder level
• Immersion silver
• OSP
• Immersion tin
• Recessed fingers

Engent works with a wide range of printing materials within RoHS, RF and advanced RF, backed with PCB FR-4 manufacturing, the most common insulation among rigid printed circuit boards.

Our printed circuit board assembly (PCBA) services utilize some of the most advanced equipment in the industry to ensure technology packages are assembled correctly to produce highly reliable products. Our experienced engineers proudly use Siemens Dematic machinery capable of a placement rate of 50,000 components per hour, ensuring quick completion of projects at a minimal cost. We’ve also invested in machines designed for maximum modularity and an extremely high degree of flexibility. Our equipment is ideal for a variety of applications, including packages requiring specialized nozzles and grippers for oddly-shaped components.

Engent also offers several other circuit board and advanced SMT assembly services, including:

• Flip chip assembly
• 01005, 0201 through 55 mm BGA processing
• Advanced area array packages (FPBGA, CCGA, HBGA, Double Sided BGA, Mirror BGA)
• Chip scale package (CSP) assembly
• 0.3mm – 0.5mm wafer scale CSP (WLCSP) assembly
• Lead-free solder
• Optoelectronics assembly
• Fiber splicing
• High-density large panel assembly