Integrated Circuit Packaging
Integrated circuit packaging (IC packaging) provides secure casing for custom microelectronics, protecting circuits and electrical contact connections from corrosion or other abrasive physical damage.
Engent also offers several other circuit board and advanced SMT assembly services, including:
- Flip chip assembly
- 01005, 0201 through 55 mm BGA processing
- Advanced area array packages (FPBGA, CCGA, HBGA, Double Sided BGA, Mirror BGA)
- Chip scale package (CSP) assembly
- 0.3mm – 0.5mm wafer scale CSP (WLCSP) assembly
- Lead-free solder
- Optoelectronics assembly
- Fiber splicing
- High-density large panel assembly
Engent’s EMS expertise is designed to enable high volume manufacturing while shortening time to market. The suite of services we provide ensures high-yield production of the industry’s most robust and reliable products available on the market. Our EMS expertise includes design, engineering, manufacturing, as well as electronic component testing and OEM assembly.
Our approach to manufacturing provides our clients with the flexibility to scale manufacturing to meet business needs, so materials, resources and expertise are only leveraged when necessary, resulting in higher efficiency and cost effective manufacturing models.