Implementation Of No-Flow Underfills On Chip Scale Packages

With decreasing solder joint size, underfill is critical in meeting reliability standards of Chip Scale Package (CSP) technology. The potential for no-flow underfills in this area is enormous in that they can be incorporated into the standard SMT process without post reflow processing.

Download our white paper to learn more about the reliability of several commercial no-flow underfills when compared to CSPs assembled with and without underfills, and learn why no-flow underfill implementation on CSP increases reliability as compared to non-underfilled devices.

Download the White Paper