Electronic Packaging Service
Engent specializes in electronic packaging services, ensuring that every product and component we help manufacture is appropriately packaged for optimal functionality and sustained value.
Engent’s expert electronic packaging services include, but are not limited to:
- PCB assemblies
- Liquid filling
- Hermetic metal/glass cases
- Hermetic ceramic packages
- Glob top
- Conformal coating
- Molded plastic
- Sheet metal
- Cast metal
- Potting
- Porosity sealing
Engent’s electronic packaging protects critical components from exposure to hostile elements and mechanical damage while maintaining proper heat dissipation and a marketable aesthetic.
Engent currently offers a variety of solutions including:
- 3D packaging
- System in packaging (SiP)
- MEMS packaging
Our experts have spent years developing the best processes and solutions that reduce package size and cost. Engent engineered a novel packaging strategy based on modular, reconfigurable components that allow us to provide significant cost savings over conventional solutions while increasing the commercial viability of a wide range of microsystems.