Electronic Components Manufacturing
At Engent, our electronic components manufacturing services are guided by years of experience and innovation. We recognize that the technologies behind electronic component manufacturing services are ever evolving, and require expert attention to ensure best practices, services and products meet the highest industry standards. Our specialists possess the skills and expertise necessary to deliver products and packages built with only the best electronic components.
Engent’s next generation manufacturing services include:
- Module, SIP, and Hybrid Package Production
- Design Layout
- Parts Procurement
- Final Testing
- Advanced SMT Production including: Flip chip, 0201s, Lead-Free, CSP, Optoelectronics, and MEMS Packaging
- Direct Chip Attach
- Multi-Chip Module Assembly
- Miniaturized Passives and Resistors (01005s)
- Advanced Technology Product Prototyping
- Design for Manufacturability Consulting
Engent’s EMS expertise is designed to enable high volume manufacturing while shortening time to market. The suite of services we provide ensures high-yield production of the industry’s most robust and reliable products available on the market. Our EMS expertise includes design, engineering, manufacturing, as well as electronic component testing and OEM assembly.
Our approach to manufacturing provides our clients with the flexibility to scale manufacturing to meet business needs, so materials, resources and expertise are only leveraged when necessary, resulting in higher efficiency and cost effective manufacturing models.