Chip on Board Assembly and Packaging
Chip on board (COB) assembly or packaging is a semiconductor assembly technology meant to eliminate conventional device packaging. Assembly directly mounts the microchip or die, connecting it to the circuit board with die-attach adhesive and curing with heat or ultra-violet light. Our expert engineers then complete the wirebonding process to protect against chemical and mechanical damage.
- Reduced space requirements
- Reduced cost
- Simplified manufacturing
- Increased performance
- Better protection against reverse-engineering
Engent also offers several other circuit board and advanced SMT assembly services, including:
- Flip chip assembly
- 01005, 0201 through 55 mm BGA processing
- Advanced area array packages (FPBGA, CCGA, HBGA, Double Sided BGA, Mirror BGA)
- Chip scale package (CSP) assembly
- 0.3mm – 0.5mm wafer scale CSP (WLCSP) assembly
- Lead-free solder
- Optoelectronics assembly
- Fiber splicing
- High-density large panel assembly
Engent’s EMS expertise is designed to enable high volume manufacturing while shortening time to market. The suite of services we provide ensures high-yield production of the industry’s most robust and reliable products available on the market. Our EMS expertise includes design, engineering, manufacturing, as well as electronic component testing and OEM assembly.
Our approach to manufacturing provides our clients with the flexibility to scale manufacturing to meet business needs, so materials, resources and expertise are only leveraged when necessary, resulting in higher efficiency and cost effective manufacturing models.