Flip Chip Assembly Process Development, Reliability Assessment And Process Characterization For Polymer Stud Grid Array-Chip Scale Package

The Polymer Stud Grid Array (PSGA) package has several significant advantages over conventional package configurations, including the high potential for miniaturization in addition to the process cost saving potential.

Download our white paper to learn more about key elements of PSGA technology, including:

  • developing a high throughput flip chip assembly process technology for PSGA-CSP configurations using existing Surface Mount Technology (SMT)
  • qualifying the reliability performance of flip chip PSGA packages

Experimental Wetting Dynamics Study Of Eutectic And Lead-Free Solders Varying Flux, Temperature And Surface Finish Metallization

Modern electronics demand improved solder bump interconnects, including high density, small size, and fine pitch. Specifically, solder wetting onto bond pads is critical in determining the interconnect process yield and the solder joint reliability.

Download our white paper to learn more about solder wetting dynamics and analytical predicting as well as the effects of solder reflow process parameters and bonding materials as they relate to solder wetting, the interconnect process yield, and solder joint reliability.

Flip Chip Processing Using Wafer-Applied Underfills

Wafer-level underfill has the potential to substantially increase the implementation and usage of flip chip technology in the electronics industry, bringing the financial benefits of wafer-level processing to flip chip assembly and packaging.

Download our white paper to learn more about wafer-level flip chip assembly processing quality, including:

  • a parametric study of the effect of underfill coating uniformity on assembly quality and underfill voiding
  • method exploration for reducing die misalignment through the use of fillet-constraining solder mask patterns
  • presentation of a theoretical description of the forces acting on a wafer-level flip chip die to better understand the influence of process and design parameters on assembly yield

Evaluation, Optimization, And Reliability Of No-Flow Underfill Process

Underfills, used in flip chip packaging, help mitigate the effects of the large Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and the laminate circuit board by reducing the strain on the solder joints. There are a series of steps that have to be taken, particularly during the no-flow underfill process, in order for it to be successful. These include:

  • utilizing fluxing underfills that are dispensed onto the substrate before placement
  • placing the die onto the dispensed underfill
  • reflowing and curing the assembly simultaneously in a standard reflow oven

Download our white paper to learn more about achieving the optimal processing for increased reliability. You’ll uncover how we optimized the placement and reflow parameters for a no-flow process using four commercially available underfill materials, and how we successfully developed a near void free no flow underfill dispense process.

Flux-Underfill Compatibility And Failure Mode Analysis In High Yield Flip Chip Processing

There are many factors that govern flip chip process yield, and with those come various challenges. One of those is the compatibility of flux and underfill, as it is intended to provide a robust flip chip process window and acceptable reliability.

Download our white paper to learn more about flux-underfill compatibility and failure mode analysis in high yield flip chip processing, including:

  • how the compatibility of flux and underfill material systems significantly contributes to the formation and growth of process-induced defects
  • an in-depth analysis of failure modes, including underfill delamination, solder fatigue, and die cracking, all in an effort to determine long-term reliability

Reliability Assessment Of Flip Chip On Organic Board Using Power Cycling Techniques

In this white paper, the reliability assessment of flip chip on organic board (FCOB) using power cycling techniques from a service field-oriented reliability assessment methodology is discussed. Ultimately, the paper concludes with how design for field reliability is achievable by the effective design modifications and manufacturing process improvements at the prototyping stage.

Download this white paper to learn more about the reliability of the flip chip on organic board assemblies and what the linkage among the design, manufacturing process, and the ultimate field reliability is prior to mass production.

Download the white paper now.