Reliability Testing

Engent utilizes state-of-the-art electronic product testing equipment to ensure maximum product reliability and performance. Our equipment tests for shock, vibration, temperature, and acceleration, and is capable of qualification and cycling testing.

Our industry best equipment includes, but is not limited to:

• Liquid thermal shock chamber
• Air thermal shock chamber
• Highly accelerated stress test (HAST) chamber
• Accelerated stress test system (HALT)
• Industrial oven
• AGREE Chamber
• Electrodynamic vibration system

Our electronic product testing services provide validation that every product we deliver will perform successfully under realistic, expected conditions.

Engent’s reliability testing includes:

• New package and assembly qualification (Level I and II)
• Product-level testing

Engent maintain full compliance with the rules and regulations set forth by the United States Consumer Product Safety Commission. Our teams possess extensive experience in electronic product testing, and are dedicated to contributing to advancements that mature industry technologies.

Packaging and Process Technology Selection and Qualification

• Semiconductor wafer solder bumping technologies specification (evaporation, electroplating, stencil printing)
• Under bump metalization specification (sputtering, evaporation, electroless plating)

Advanced Assembly Technology Success Story

When an OEM needed very quick-turn assembly of a new board using consigned material, they found that their EMS provider’s high-volume lines were running with no open capacity.

Advanced Assembly Technology Solution:

Engent set up, assembled and delivered the boards – ahead of schedule. Of more significance is the early determination during first article inspection of a thin HASL finish on the boards, which would have resulted in poor solderability. New boards were obtained and the total solution of process knowledge, capability, and customer support allowed this product to be delivered on time.

 

• Our Process
• Procure and Receive Material Data
• Material Inventory
• Software Generation
• Setup Generation
• First Article Assembly
• Assembly of Remaining Kit
• Documentation and Delivery

Materials Selection and Qualification

Qualified Surface Finish Selection

• Flux Selection
• Underfill Selection
• Solder mask Selection
• Substrate Selection
• Qualified Material Systems

Read More

Advanced Process Development and Deployment

• Qualified Surface Finish Selection
• Flux Selection
• Underfill Selection
• Solder mask Selection
• Substrate Selection
• Qualified Material Systems

Electronic Failure Analysis

Engent’s electronic failure analysis services are refined to produce the most accurate product results and develop appropriate measures to prevent the recurrence of failure. Our services combine the most advanced technologies with the talent of our expert engineers.

Engent’s electronic failure analysis services can be applied to an entire spectrum of components including:

• Area array packages (BGAs, CSPs, flip chip)
• MEMS structures
• Hybrid micro circuits
• Multi-chip modules
• Integrated circuits
• Discrete transistors and diodes
• Photonic devices (VCSELs, laser diodes, LEDs)
• Chip on board
• RF, microwave, and SAW devices

Engent’s analytical and failure analysis equipment includes:

• Low pressure SEM
• SEM backscatter detector
• Energy disperse X-Ray analysis
• High magnification polarizing light/dark field microscope
• Metallagraph
• Differential contrast microscope
• X-Ray florescence microscope
• Megapixel digital camera
• CSAM (acoustic microscopy)
• IR microscope
• 3D surface inspection system
• High speed digital video camera
• Digital image analysis software
• Boroscope
• FT-IR
• DSC (digital scanning calorimeter)
• Rheometer
• Viscometer
• TGA (thermo gravimetric analysis)
• DMA (dynamic mechanical analysis)
• TMA (thermo mechanical analysis)

Read our case studies (add link here) for an in-depth look at how Engent engineers solve problems with product failures.