Technology Commercialization

Engent provides customer support from conception through manufacturing. Our engineers employ applications that support proof of concept development, prototyping and testing to advance technology into a commercial application.

Our technology commercialization services include:

  • Advanced Process Development
  • Advanced Technology Component Prototyping
  • Materials Analysis and Characterization

Flip Chip Technology

Flip chip, or C4 (controlled collapse chip connection), is a system-in-package assembly service that provides numerous benefits over other processes of interconnection. Also known as direct chip attach, flip chip bonding is quickly taking precedence over traditional wire bonding in many applications due to its high performance, smaller footprint and greater reliability.

Engent’s flip chip and bonding services are designed to enhance electronics systems by providing a smaller system both in height and overall area. Flip chip processes also conduct heat more effectively, allowing for faster signals and minimizing risk. Our technology specialists provide cost effective bonding solutions without sacrificing performance.

Engent’s other advanced surface mount processing and packaging services include:


  • SIP and module deployment to low cost production
  • Wafer level packaging DFM
  • SIP / module packaging DFM
  • Integrated SIP-SMT processing
  • Bare die handling (Si, SiGe, GaAs, InP, Lithium)
  • Substrate selection (AlN, LTCC, HTCC, Thermount®, BT, FR-5, polyimide, metal core)
  • Wire bonding DFM (ball, wedge, ribbon)
  • BGA packaging DFM
  • Gallium alloy interconnects, conductors and bonding (optical fiber bonding, via filling)
  • Encapsulation techniques

Next Generation Engineering and Process Development

Turnkey Next Generation Manufacturing Services

Module, SIP, and Hybrid Package Production

Design Layout

Parts Procurement




Final Test

Advanced SMT Production, including Flip Chip, 0201s, Lead-Free, CSP, Optoelectronics, and MEMS


Advanced Technology Product Prototyping

Design for Manufacturability Consulting

MEMS Technology and Packaging

Engent provides advanced MEMS (micro electro mechanical systems) technology and packaging services that benefit a wide variety of applications. Designed to protect devices from environmental elements such as moisture, unwanted current and chemicals, MEMS has emerged as a rapidly growing technology as it has proven incredibly useful in meeting the demands of micro-scale applications.

MEMS generally consists of the following components:

  • Micro-sensors
  • Micro-actuators
  • Micro-structures
  • Micro-electronics

Each device that employs MEMS technology has its own unique operational demands and considerations that must be made when developing the correct packaging option. Engent’s MEMS experts design packages specific to the needs of each device while addressing packaging issues such as media compatibility, stress, integration and testing.

Commercial applications utilizing MEMS components include:

  • Inkjet printers
  • Gaming inertia sensors
  • Hard-disk protection
  • Automotive parts including accelerometers and airbags
  • Accelerometers in personal media players, cell phones and digital cameras
  • Microphones in cell phones and laptops
  • Blood pressure sensors
  • Biosensors and chemo sensors

Engent’s MEMS services include best industry sealing methods for all types of packages, including:

  • Chip carrier
  • Pin array
  • Dual inline packaging (DIP)

Engent’s engineers and specialists develop both the technology and packaging to ensure proper delivery and performance of applications while shortening time to market utilizing the most cost-effective model possible.

Surface Mount Assembly and Processing

Engent provides advanced surface mount technology (SMT) assembly services across a variety of electronic circuit applications. In modern electronic circuit manufacturing, SMT has become the ideal means of production. Advanced SMT extends the viability of printed surface boards, providing ideal size options while mounting on both sides of the circuit board. Due to an increasing demand for smaller, lighter, faster, more powerful, and more memory intensive packages, SMT will continue to serve a growing niche in the industry.

Technologies that drive the advancement of SMT include:

  • Laptops, netbooks, and PDA devices
  • Network and telecommunications
  • Intuitive automobile development
  • Department of Defense initiatives

Engent’s SMT services provide a host of benefits for manufacturing and implementation, including:

  • Significantly increased manufacturing efficiency
  • Significantly decreased weight and size
  • Cost reduction for parts and handling
  • Reduced layer counts and holes drilled
  • Greater shock and vibration resistance
  • Noise reduction for greater package quality
  • Reduced power consumption and heat generation

Our advanced surface mount technology assembly services include:

  • Flip chip
  • Direct chip attach and chip on board (COB)
  • 01005, 0201 through 55mm BGA processing
  • Adv. area array packages (FPBGA, CCGA, HBGA, double sided BGA, mirror BGA)
  • Chip scale package (CSP) assembly
  • 0.3mm-0.5mm wafer scale CSP (WLCSP) assembly
  • Lead-free solder
  • Optoelectronics assembly
  • Fiber splicing
  • High-density large panel assembly

Our advanced surface mount technology processing services include:

  • Standard SMT components (all types)
  • Lead free solder
  • High speed 01005, 0201, 0402, 0603, 0805
  • BGA and fine pitch BGA
  • Advanced area array package
  • CBGA
  • CCGA
  • HBGA
  • Double sided BGAs
  • Mirror image BGAs
  • CSP, mBGA, and wafer level CSP
  • Fine pitch CSP to 0.3mm
  • Reworkable underfill BGAs/CSPs
  • Fluxless reflow soldering
  • Fine pitch stencil printing
  • Flip chip on board
  • Pin-through hole
  • Through hole connector rework systems
  • BGA/CSP/area array package rework systems