Next Generation Engineering and Process Development
Turnkey Next Generation Manufacturing Services
Module, SIP, and Hybrid Package Production
Design Layout
Parts Procurement
Assembly
Balling
Overmolding
Final Test
Advanced SMT Production, including Flip Chip, 0201s, Lead-Free, CSP, Optoelectronics, and MEMS
Packaging
Advanced Technology Product Prototyping
Design for Manufacturability Consulting