Experimental Wetting Dynamics Study Of Eutectic And Lead-Free Solders Varying Flux, Temperature And Surface Finish Metallization

Modern electronics demand improved solder bump interconnects, including high density, small size, and fine pitch. Specifically, solder wetting onto bond pads is critical in determining the interconnect process yield and the solder joint reliability.

Download our white paper to learn more about solder wetting dynamics and analytical predicting as well as the effects of solder reflow process parameters and bonding materials as they relate to solder wetting, the interconnect process yield, and solder joint reliability.

Download the White Paper