Posted by Engent, Inc. on | Comments Off on FlipChip International and Engent Announce Strategic Alliance to Develop and Deploy 3D Wafer Level CSP Technologies
FlipChip International and Engent today announced a strategic alliance aimed at accelerating the development and deployment of 3D Wafer Level CSP (WLCSP)Technologies for highly integrated stacked die packaging applications. This technology has the possibility of enabling packaging solutions that are quicker to market and lower cost than System-On-Chip alternatives. Engent is a prominent leader in 3D flip chip assembly and FlipChip International is the world’s leading wafer level bumping company.
Posted by Engent, Inc. on | Comments Off on Engent Receives ISO 9001:2000 Certification
Engent, Inc. received its ISO 9001:2000 certification through Underwriters Laboratories Inc. on February 22, 2008. ISO 9001:2000 is recognized worldwide as the standard for quality management systems. Engent’s quality management system was approved for the manufacturing of electronic and micro-electronic assemblies and packages.
Posted by Engent, Inc. on | Comments Off on Dr. Daniel Baldwin named President-Elect of SMTA
Dr. Daniel F. Baldwin, President, of Engent Inc. has been elected to serve as the President for the Surface Mount Technology Association (SMTA). The SMTA is an International network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. Dr. Baldwin has been active with SMTA for 13 years and has served in several leadership roles including member of the SMTA International technical program committee and Co-Chair of the SMTA 3D/SiP/Advanced Packaging Symposium, and on the Board of Directors for the past six years as a Member of the Planning Committee, the Chair of the Planning Committee, and Treasurer. Dr. Baldwin, said, “I am honored to be selected to serve our industry in the capacity of SMTA President. The SMTA fills a vital role in the electronics industry by providing a forum for the industry to keep moving towards solutions that foster competiveness and innovation.”
Posted by Engent, Inc. on | Comments Off on Engent Receives ITAR Registration Renewal
Engent has received its annual International Traffic Arms in Regulation (ITAR) approval for registration from the US department of States, Bureau of Political-Military Affairs. ITAR regulations dictate that information and material pertaining to defense and military related technologies may only be shared with U.S. persons unless approval from the Department of State is received or a special exemption is used. This classification is a requirement for many defense related manufacturing and development programs. Matt Perry, Engent’s Vice President of Sales, noted “Engent is committed to providing a valuable, advanced technology service offering to our customers. Our unique electronics manufacturing and development infrastructure allows us to support programs that require both Surface Mount electronics and Micro-electronics assembly. We are seeing more small form factor applications that require ITAR compliance and are positioned well to support these programs.”
Posted by Engent, Inc. on | Comments Off on Engent Hires Brian Spratt as Business Development Manager
In efforts to bolster their sales services in the southeast United States, Engent, a leading provider of next generation electronic manufacturing and technology services, announces that Brian Spratt has joined the company as business development manager for the region. Spratt brings 15 years of experience to the position and will offer Engent’s surface mount technology (SMT) manufacturing, advanced electronics manufacturing, engineering services and testing, and materials to companies in the area.
Posted by Engent, Inc. on | Comments Off on Engent Expands Testing Capabilities in Response to Customer Demand
In response to customer demand, Engent, a leading provider of next generation electronics manufacturing and technology services, has added SPEA 4060M Flying Probe to its comprehensive testing services. The technology provides an additional resource for original equipment manufacturers (OEMs) to take advantage of leading-edge fixtureless testing regardless of company size.
Posted by Engent, Inc. on | Comments Off on Engent Expands Operations
In order to ramp-up production capacity and accelerate new product development efforts, Engent recently expanded its Norcross, GA facility by 8,000 square feet. Engent acquired the square footage that was previously occupied by Siemens Logistics and Assembly Systems. Over the past 18 months, Engent has experienced significant growth, and this additional space enables the ongoing manufacturing expansion of its small form factor micro-electronics products.
“The facility expansion is part of a strategic decision by Engent to enhance our manufacturing capacity and capability as well as provide needed space for increasing research and development efforts. Our customers continue to drive Engent towards providing more value added services to support miniaturized and high performance electronics. This expansion will strengthen our company’s position to address many of the challenges facing the industry without disrupting ongoing projects,” said Tim Sparks, VP of Operations.
