News and Press Releases

• DEK Horizon 03iX Selected for Next-Generation Technology Line at Engent
  
  Printing technology market leader, DEK, announces that its customer, Engent, Inc., is expanding production capacity and has selected DEK’s Horizon 03iX print platform to provide advanced capability for fine-pitch, leading-edge assemblies.
  
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• Engent Expands Operations
  
  In order to ramp-up production capacity and accelerate new product development efforts, Engent recently expanded its Norcross, GA facility by 8,000 square feet. Engent acquired the square footage that was previously occupied by Siemens Logistics and Assembly Systems. Over the past 18 months, Engent has experienced significant growth, and this additional space enables the ongoing manufacturing expansion of its small form factor micro-electronics products.
  
  "The facility expansion is part of a strategic decision by Engent to enhance our manufacturing capacity and capability as well as provide needed space for increasing research and development efforts. Our customers continue to drive Engent towards providing more value added services to support miniaturized and high performance electronics. This expansion will strengthen our company's position to address many of the challenges facing the industry without disrupting ongoing projects," said Tim Sparks, VP of Operations.
  
  In addition, Engent has received commitments that will allow for additional build-out and future expansion to support continued growth.
  

• Engent Receives ITAR Registration Renewal
  
  Engent has received its annual International Traffic Arms in Regulation (ITAR) approval for registration from the US department of States, Bureau of Political-Military Affairs. ITAR regulations dictate that information and material pertaining to defense and military related technologies may only be shared with U.S. persons unless approval from the Department of State is received or a special exemption is used. This classification is a requirement for many defense related manufacturing and development programs. Matt Perry, Engent's Vice President of Sales, noted "Engent is committed to providing a valuable, advanced technology service offering to our customers. Our unique electronics manufacturing and development infrastructure allows us to support programs that require both Surface Mount electronics and Micro-electronics assembly. We are seeing more small form factor applications that require ITAR compliance and are positioned well to support these programs."
  

• Dr. Daniel Baldwin named President-Elect of SMTA
  
  Norcross, GA. - Dr. Daniel F. Baldwin, President, of Engent Inc. has been elected to serve as the President for the Surface Mount Technology Association (SMTA). The SMTA is an International network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. Dr. Baldwin has been active with SMTA for 13 years and has served in several leadership roles including member of the SMTA International technical program committee and Co-Chair of the SMTA 3D/SiP/Advanced Packaging Symposium, and on the Board of Directors for the past six years as a Member of the Planning Committee, the Chair of the Planning Committee, and Treasurer. Dr. Baldwin, said, "I am honored to be selected to serve our industry in the capacity of SMTA President. The SMTA fills a vital role in the electronics industry by providing a forum for the industry to keep moving towards solutions that foster competiveness and innovation."
  
  

• Engent Receives ISO 9001:2000 Certification
  
  Norcross, GA. - Engent, Inc. received its ISO 9001:2000 certification through Underwriters Laboratories Inc. on February 22, 2008. ISO 9001:2000 is recognized worldwide as the standard for quality management systems. Engent's quality management system was approved for the manufacturing of electronic and micro-electronic assemblies and packages.
  
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• FlipChip International and Engent Announce Strategic Alliance to Develop and Deploy 3D Wafer Level CSP Technologies
  
  PHOENIX, ARIZONA May 23rd, 2006-FlipChip International and Engent today announced a strategic alliance aimed at accelerating the development and deployment of 3D Wafer Level CSP (WLCSP)Technologies for highly integrated stacked die packaging applications. This technology has the possibility of enabling packaging solutions that are quicker to market and lower cost than System-On-Chip alternatives. Engent is a prominent leader in 3D flip chip assembly and FlipChip International is the world's leading wafer level bumping company.
  
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• Flip Chip Presentation Draws Local IMAPS and SMTA Members
  
  BOXBOROUGH, MA - For the second time this year, SMTA Boston and IMAPS New England members shared ideas and information over dinner in a joint meeting and presentation, held March 21, 2006, at the Holiday Inn Boxborough Woods. The evening's program included a presentation titled "Flip Chip Technology - What, Why, and How?" by Daniel Baldwin, Ph.D., Professor of Mechanical Engineering at the Georgia Institute of Technology, and co-founder of Engent, provider of advanced electronic manufacturing and technology services. Baldwin also serves on Advanced Packaging's Editorial Advisory Board.
  
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• SMT Magazine Q&A :: World-class manufacturing
  
  As the manufacturing sector continues to recover and orders continue to grow, claims about world-class manufacturing are ever present in the industry. Dr. Baldwin describes the key differentiators of a world-class manufacturer.
  
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• Engent Announces its Lead Free Deployment Solutions Program
  
  Engent, Inc. has announced the creation of its Lead Free Deployment Solutions Program. The use of lead in electronics products has been considered an environmental issue and is beginning a "phase out" in different parts of the world.
  
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• SMT Magazine :: Q & A
  
  Daniel F. Baldwin, president of Engent Inc., answers questions about the advantages of a Design for Manufacturing (DFM) environment and automating the process to ensure high-yield volume manufacturing.
  
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• SMT Magazine :: Q & A
  
  Daniel F. Baldwin, president of Engent Inc., answers questions about the implementation challenges of Lead-free solder in Flip Chip and CSP Applications.
  
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• IPC Solder Products Value Council, Solectron, Flextronics and U.S. NAVSEA Begin Reliability Test Program on Lead Free Solder
  
  IPC-Association Connecting Electronics Industries® announced today that its Solder Products Value Council (SPVC) has begun a comprehensive study of the three leading lead free alloys (Tin-Silver-Copper) in an effort to analyze the properties of the leading candidates for lead free assembly.
  
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• Engent Acquires Rights to Siemens Dematic Advanced Assembly Technology Center
  
  Engent, Inc. and Siemens Dematic Electronics Assembly Systems, Inc. (EAS) have signed an agreement for Engent to assume the rights to the Advanced Assembly Technology (AAT) Center contracts, equipment and personnel located in Norcross, Georgia. Additionally, Engent will become a member of the newly formed Siemens Dematic Technology Network, and the two companies will work closely together to provide advanced technology solutions to the electronics industry.
  
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