News and Press Releases
Engent Hires Andrey Karnauch as Operations Manager
Industry veteran will help company better serve electronics market through enhanced production services and quality assurance
HDP User Group Announces New Member Company
Cave Creek, Arizona May 22, 2013. The High Density Packaging (HDP) User Group headquartered in the United States
announces that Engent, Inc. has become its newest member.
DEK Horizon 03iX Selected for Next-Generation Technology Line at Engent
Printing technology market leader, DEK, announces that its customer, Engent, Inc., is expanding production
capacity and has selected DEK’s Horizon 03iX print platform to provide advanced capability for fine-pitch,
Engent Expands Operations
In order to ramp-up production capacity and accelerate new product development efforts, Engent recently expanded
Norcross, GA facility by 8,000 square feet. Engent acquired the square footage that was previously occupied by
Siemens Logistics and Assembly Systems. Over the past 18 months, Engent has experienced significant growth, and
additional space enables the ongoing manufacturing expansion of its small form factor micro-electronics
"The facility expansion is part of a strategic decision by Engent to enhance our manufacturing capacity and
capability as well as provide needed space for increasing research and development efforts. Our customers
to drive Engent towards providing more value added services to support miniaturized and high performance
electronics. This expansion will strengthen our company's position to address many of the challenges facing the
industry without disrupting ongoing projects," said Tim Sparks, VP of Operations.
In addition, Engent has received commitments that will allow for additional build-out and future expansion to
support continued growth.
Engent Receives ITAR Registration Renewal
Engent has received its annual International Traffic Arms in Regulation (ITAR) approval for registration from
department of States, Bureau of Political-Military Affairs. ITAR regulations dictate that information and
pertaining to defense and military related technologies may only be shared with U.S. persons unless approval
the Department of State is received or a special exemption is used. This classification is a requirement for
defense related manufacturing and development programs. Matt Perry, Engent's Vice President of Sales, noted
is committed to providing a valuable, advanced technology service offering to our customers. Our unique
manufacturing and development infrastructure allows us to support programs that require both Surface Mount
electronics and Micro-electronics assembly. We are seeing more small form factor applications that require ITAR
compliance and are positioned well to support these programs."
Dr. Daniel Baldwin named President-Elect of SMTA
Norcross, GA. - Dr. Daniel F. Baldwin, President, of Engent Inc. has been elected to serve as the President for
Surface Mount Technology Association (SMTA). The SMTA is an International network of professionals who build
share practical experience and develop solutions in electronic assembly technologies, including microsystems,
emerging technologies, and related business operations. Dr. Baldwin has been active with SMTA for 13 years and
served in several leadership roles including member of the SMTA International technical program committee and
Co-Chair of the SMTA 3D/SiP/Advanced Packaging Symposium, and on the Board of Directors for the past six years
Member of the Planning Committee, the Chair of the Planning Committee, and Treasurer. Dr. Baldwin, said, "I am
honored to be selected to serve our industry in the capacity of SMTA President. The SMTA fills a vital role in
electronics industry by providing a forum for the industry to keep moving towards solutions that foster
competiveness and innovation."
Engent Receives ISO 9001:2000 Certification
Norcross, GA. - Engent, Inc. received its ISO 9001:2000 certification through Underwriters Laboratories Inc. on
February 22, 2008. ISO 9001:2000 is recognized worldwide as the standard for quality management systems.
quality management system was approved for the manufacturing of electronic and micro-electronic assemblies and
FlipChip International and Engent Announce Strategic Alliance to Develop and Deploy 3D Wafer Level CSP
PHOENIX, ARIZONA May 23rd, 2006-FlipChip International and Engent today announced a strategic alliance aimed at
accelerating the development and deployment of 3D Wafer Level CSP (WLCSP)Technologies for highly integrated
die packaging applications. This technology has the possibility of enabling packaging solutions that are quicker
market and lower cost than System-On-Chip alternatives. Engent is a prominent leader in 3D flip chip assembly
FlipChip International is the world's leading wafer level bumping company.
Flip Chip Presentation Draws Local IMAPS and SMTA Members
BOXBOROUGH, MA - For the second time this year, SMTA Boston and IMAPS New England members shared ideas and
information over dinner in a joint meeting and presentation, held March 21, 2006, at the Holiday Inn Boxborough
Woods. The evening's program included a presentation titled "Flip Chip Technology - What, Why, and How?" by
Baldwin, Ph.D., Professor of Mechanical Engineering at the Georgia Institute of Technology, and co-founder of
Engent, provider of advanced electronic manufacturing and technology services. Baldwin also serves on Advanced
Packaging's Editorial Advisory Board.
SMT Magazine Q&A :: World-class manufacturing
As the manufacturing sector continues to recover and orders continue to grow, claims about world-class
are ever present in the industry. Dr. Baldwin describes the key differentiators of a world-class manufacturer.
Engent Announces its Lead Free Deployment Solutions Program
Engent, Inc. has announced the creation of its Lead Free Deployment Solutions Program. The use of lead in
electronics products has been considered an environmental issue and is beginning a "phase out" in different
SMT Magazine :: Q & A
Daniel F. Baldwin, president of Engent Inc., answers questions about the advantages of a Design for
(DFM) environment and automating the process to ensure high-yield volume manufacturing.
SMT Magazine :: Q & A
Daniel F. Baldwin, president of Engent Inc., answers questions about the implementation challenges of Lead-free
solder in Flip Chip and CSP Applications.
IPC Solder Products Value Council, Solectron, Flextronics and
U.S. NAVSEA Begin Reliability Test Program on Lead Free Solder
IPC-Association Connecting Electronics Industries® announced today that its Solder Products Value Council
(SPVC) has begun a comprehensive study of the three leading lead free alloys (Tin-Silver-Copper) in an effort to
analyze the properties of the leading candidates for lead free assembly.
Engent Acquires Rights to Siemens Dematic Advanced Assembly Technology Center
Engent, Inc. and Siemens Dematic Electronics Assembly Systems, Inc. (EAS) have signed an agreement for Engent to
assume the rights to the Advanced Assembly Technology (AAT) Center contracts, equipment and personnel located in
Norcross, Georgia. Additionally, Engent will become a member of the newly formed Siemens Dematic Technology
and the two companies will work closely together to provide advanced technology solutions to the electronics